spec no: cda0440 rev no: v.1 date: oct/27/2001 page: 1 of4 approved : j. lu checked : drawn: m.f.cai AA2734SRSGC suepr bright red super bright green description the super bright red source color devices are made with gallium aluminum arsenide red light emitting diode. the super bright green source color devices are made with gallium phosphide green light emitting diode. package dimensions features ! 2.7mm x 3.4mm smt led, 1.5mm height only. ! both chips can be controlled separately. ! suitable for all smt assembly and solder process. ! available on tape and reel. ! ideal for backlighting. ! package: 1000pcs / reel. notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0 .25(0.01") unless otherwise noted. 3. lead spacing is measured where the lead emerge package. 4. specifications are subject to change without notice. 2.7x3.4mm surface mount led lamp
spec no: cda0440 rev no: v.1 date: oct/27/2001 page: 2 of4 approved : j. lu checked : drawn: m.f.cai selection guide electrical / optical characteristics at t a =25 c absolute maximum ratings at t a =25 c note: 1. 1/10 duty cycle, 0.1ms pulse width. note: 1 . 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. l o b m y sl o b m y s l o b m y s l o b m y sl o b m y sr e t e m a r a pr e t e m a r a p r e t e m a r a p r e t e m a r a pr e t e m a r a pe c i v e de c i v e d e c i v e d e c i v e de c i v e d. p y t. p y t . p y t . p y t. p y t. x a m. x a m . x a m . x a m. x a ms t i n us t i n u s t i n u s t i n us t i n us n o i t i d n o c t s e ts n o i t i d n o c t s e t s n o i t i d n o c t s e t s n o i t i d n o c t s e ts n o i t i d n o c t s e t k a e p h t g n e l e v a w k a e p d e r t h g i r b r e p u s n e e r g t h g i r b r e p u s 0 6 6 5 6 5 m na m 0 2 = f i d h t g n e l e v a w e t a n i m o d d e r t h g i r b r e p u s n e e r g t h g i r b r e p u s 0 4 6 8 6 5 m na m 0 2 = f i ? 2 / 1 h t d i w f l a h e n i l l a r t c e p s d e r t h g i r b r e p u s n e e r g t h g i r b r e p u s 0 2 0 3 m na m 0 2 = f i ce c n a t i c a p a c d e r t h g i r b r e p u s n e e r g t h g i r b r e p u s 5 4 5 1 f pz h m 1 = f ; v 0 = f v v f e g a t l o v d r a w r o f d e r t h g i r b r e p u s n e e r g t h g i r b r e p u s 5 8 . 1 2 . 2 5 . 2 5 . 2 va m 0 2 = f i i r t n e r r u c e s r e v e rl l a0 1a uv 5 = r v r e t e m a r a pr e t e m a r a p r e t e m a r a p r e t e m a r a pr e t e m a r a pd e r t h g i r b r e p u sd e r t h g i r b r e p u s d e r t h g i r b r e p u s d e r t h g i r b r e p u sd e r t h g i r b r e p u sn e e r g t h g i r b r e p u sn e e r g t h g i r b r e p u s n e e r g t h g i r b r e p u s n e e r g t h g i r b r e p u sn e e r g t h g i r b r e p u ss t i n us t i n u s t i n u s t i n us t i n u n o i t a p i s s i d r e w o p0 0 15 0 1w m t n e r r u c d r a w r o f c d0 35 2a m ] 1 [ t n e r r u c d r a w r o f k a e p5 5 10 4 1a m e g a t l o v e s r e v e r55v e r u t a r e p m e t e g a r o t s / g n i t a r e p o 0 4 - 5 8 + o t c c . o n t r a p. o n t r a p . o n t r a p . o n t r a p. o n t r a pe c i de c i d e c i d e c i de c i de p y t s n e le p y t s n e l e p y t s n e l e p y t s n e le p y t s n e l ) d c m ( v i) d c m ( v i ) d c m ( v i ) d c m ( v i) d c m ( v i a m 0 2 @ g n i w e i vg n i w e i v g n i w e i v g n i w e i vg n i w e i v e l g n a . n i m. n i m . n i m . n i m. n i m. p y t. p y t . p y t . p y t. p y t 2 / 1 22 / 1 2 2 / 1 2 2 / 1 22 / 1 2 c g s r s 4 3 7 2 a a ) s a l a a g ( d e r t h g i r b r e p u s r a e l c r e t a w 0 40 5 1 0 2 1 ) p a g ( n e e r g t h g i r b r e p u s 80 3
spec no: cda0440 rev no: v.1 date: oct/27/2001 page: 3 of4 approved : j. lu checked : drawn: m.f.cai super bright red / super bright green AA2734SRSGC
spec no: cda0440 rev no: v.1 date: oct/27/2001 page: 4 of4 approved : j. lu checked : drawn: m.f.cai AA2734SRSGC smt reflow soldering instruction recommended soldering pattern (units : mm) tape specifications (units : mm) number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
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